TSMC, Amkor lock in 10-year deal for advanced packaging and test services

Two Valley semiconductor giants have formalized a long-planned partnership.

Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced the finalization of a 10-year partnership agreement on June 16.

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The collaboration establishes a structured approach for TSMC to receive advanced packaging and test services from Amkor, along with coordinated capacity expansion and planning. The partnership aims to create a mutually beneficial operating model that caters to customers’ requirements as efficiently as possible. It builds off a memorandum of understanding that was originally entered into in 2024, according to past Business Journal reporting.

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“This agreement marks an important next step in our partnership with TSMC as we accelerate advanced semiconductor manufacturing in the U.S. to provide our customers a full U.S. supply chain from advanced silicon manufacturing to tested packaged devices,” Amkor CEO Kevin Engel said in a statement.

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Read more of this story from the Business Journal.

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