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Taiwan Semiconductor Manufacturing Co. plans to use ASML’s next-generation advanced chipmaking machines in high-volume manufacturing starting in 2030 to meet AI-related industry demand.
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TSMC on Tuesday announced its commitment to use Dutch semiconductor supplier ASML’s High NA extreme ultraviolet lithography machines, which can cost as much as $400 million each and are used to print intricate circuit patterns onto semiconductor wafers.
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As technology nodes advance, TSMC expects the use of High NA EUV machines to rise, driven primarily by “the increasingly complex transistor architectures required for AI applications,” according to the company.
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Read more of this story from the Business Journal.